Events 2016

VIA hosts and attends leading industrial events throughout the year that cater to strategic markets or technologies. Check out the following recent events:

Droidcon Beijing 2016
Booth D,
Beijing Yulong International Hotel
Beijing, China
November 17-18, 2016
VIA Attends Droidcon Beijing 2016
China High-Tech Fair
Booth #1A61,
Shenzhen Convention and Exhibition Center
Shenzhen, China
November 16-21, 2016
VIA Attends China High-Tech Fair
China International Industry Fair
Booth #A118,
National Exhibition and Convention Center
Shanghai, China
November 1-5, 2016
VIA Attends China International Industry Fair
IoT Tech Expo North America
Booth #46,
Santa Clara Convention Center
California, USA
October 20-21, 2016
VIA Attends IoT Tech Expo North America
ITpro EXPO 2016
Booth #810, East Hall 5
Tokyo Big Sight International Exhibition Center,
Tokyo, Japan
October 19-21, 2016
VIA Attends ITpro EXPO
TranspoQuip Latin America
Booth #606
Expo Center Norte,
São Paulo, Brazil
October 4-6, 2016
VIA Attends TranspoQuip Latin America
China Internet of Things Summit
Booth #2
Marriott Hotel Hongqiao,
Shanghai, China
September 8-9, 2016
VIA Attends China Internet of Things Summit
Japan Truck Show
Booth #K-14
Exhibition Hall PACIFICO
Yokohama, Japan
September 1-3, 2016
VIA Attends Japan Truck Show
IoT Trade Fair and Conference – Latin America
Booth #304
Centro de Eventos Frei Caneca
São Paulo, Brazil
September 1-2, 2016
VIA Attends IoT Trade Fair and Conference – Latin America
Flash Memory Summit
Booth #818
Santa Clara Convention Center
Santa Clara, CA
August 9-11, 2016
VIA Attends Flash Memory Summit
SORACOM "Discovery" Conference
BELLESALLE Shinjuku Grand Event Hall
Tokyo, Japan
July 13, 2016
VIA Attends SORACOM"Discovery" Conference
OCF Computex 2016
TWTC Hall 1 CR 2, Taipei, Taiwan
May 31-June 4, 2016
Industry Cooperation, Liaisons, and Other IoT Ecosystems: Presented by Richard Brown, VP International Marketing, VIA Technologies, Inc.
IoT DevCon
Hyatt Regency, Santa Clara, CA
May 25-26, 2016
Booth# S5, Santa Clara Ballroom
VIA Attends IoT DevCon 2016
Embedded Systems Expo
Tokyo Big Sight, Japan
May 11-13, 2016
Booth# W5-45, West Hall
VIA Attends ESEC 2016
InfoComm China 2016
China National Convention Center, Beijing
April 13-15, 2016
Booth# CC1-01, Hall C
VIA Attends InfoComm China 2016
Mid-America Trucking Show
Louisville, Kentucky
Mar. 31-Apr. 2, 2016
Booth# 60113 West Wing
VIA Mobile360 Surround View System @ the 2016 Mid-America Trucking Show
Embedded World 2016
Nuremberg, Germany
Feb. 23-25, 2016
Booth# 4A-251 Hall 4A
VIA Demonstrates VIA Mobile360 In-Vehicle Surround View Fleet Management System at Embedded World 2016

Other years: 2019, 2018, 2017, 2015, 2014

VIA Technologies, Inc.