VIA Embedded Boards, Modules, and Accessories

VIA Embedded Boards, Modules, and Accessories

VIA Boards and Modules

Accelerate the development of your Edge AI, Edge Computing, and IoT systems with our comprehensive range of versatile and reliable boards and modules. Available in a rich array of configurations and form factors, VIA boards and modules combine low power consumption and advanced compute and multimedia performance with rich I/O and connectivity features and flexible customization options.

VIA boards and modules are powered by a wide selection of ARM SoC platforms from Qualcomm, NXP, and VIA accompanied by Android and Linux BSPs to facilitate system development. Small form factor boards featuring low-power VIA x86 processors are also available.

Built to the highest standards of quality and reliability, VIA boards and modules come with up to 7 years of longevity to support customers with extended product life cycles. You can also take advantage of our extensive hardware and software customization services to create truly differentiated products for your target markets and optimize your edge intelligence and IoT system development.


Qualcomm® Snapdragon™ 820E Embedded Platform

Jumpstart your Edge AI system innovation with our high-performance modules and developer kits powered by the Qualcomm® Snapdragon™ 820E Embedded Platform:


NXP i.MX 6QuadPlus, 6Quad, and i.MX 6DualLite series SoCs

Speed up your Edge Computing and IoT system development with our highly-integrated boards and modules powered by NXP i.MX 6QuadPlus, 6Quad, and i.MX 6DualLite series SoCs:


VIA ARM SoCs

Develop best-of-breed edge intelligence and IoT systems with our feature-rich boards, modules, and starter kits powered by VIA ARM SoCs:


VIA x86 Processors

Enable high-performance edge intelligence and IoT systems with our ultra-reliable boards and modules powered by VIA x86 processors:


VIA Accessories

Enhance the functionality of your Edge AI, Edge Computing, and IoT systems with our extensive range of accessories:


VIA Technologies, Inc.