Yesterday the Tokyo Conference Center was buzzing with visitors eager to learn how ARM–based devices are “Shaping the Connected World.”
At this year’s China Hi-Tech Fair, visitors to the VIA booth had the chance to experience Virtual Reality (VR) firsthand with the inclusion of an HTC Vive live demo.
The new VIA EPIA-E900 Pico-ITXe board brings the flexibility of the modular approach to single-board design, creating the most versatile platform for building a diverse range of ultra-small form factor devices.
Gateway systems are a lynchpin in any Enterprise IoT ecosystem, playing the pivotal role of ensuring the secure collection and transmission of mission-critical data.
The VIA ARTiGO A600 has been specifically engineered to speed development, deployment and ease system management for the next generation of intelligent distributed manufacturing systems.