MediaTek Genio 500 SoC
MediaTek Genio 500 SoC
Fanless ultra-compact form factor
Fanless ultra-compact form factor
Flexible wireless connectivity options
Flexible wireless connectivity options
Overview
Accelerate time-to-market for next-generation edge AI devices with the VIA ARTiGO A950. Coupling the powerful MediaTek Genio 500 octa-core SoC with extensive I/O and connectivity features, this ultra-compact intelligent edge system provides a durable, high-performance platform for a broad spectrum of commercial, consumer, mobile, and industrial applications, including facial recognition, object identification, motion tracking, OCR, and bio-metric measurement.
Hardware
VIA ARTiGO A950 – Front
VIA ARTiGO A950 – Rear
The VIA ARTiGO A950 intelligent edge system features a MediaTek Genio 500 octa-core SoC with four Cortex-A73 @ 2.0GHz and four Cortex-A53 @ 2.0GHz processors and support for full HD hardware accelerated H.265/H.264 video decoding. This high-performance SoC also has an integrated AI processor for computer vision, deep learning, and neural network acceleration applications.
The system’s I/O and connectivity features include one HDMI port, one USB 2.0 port, one SIM card slot, and one miniPCIe slot, as well as two Ethernet ports, dual-band 802.11ac Wi-Fi with Bluetooth 5.0, and 4G/5G support through an optional miniPCIe wireless adaptor.
With its small footprint measuring just 147.25mm (W) x 34mm (H) x 103.5mm (D) (5.8” x 1.34” x 4.07”), the VIA ARTiGO A950 can be easily installed in virtually any commercial, industrial, or home environment.
The VIA ARTiGO A950 intelligent edge system is available for purchase along with an optional 4G LTE module for Japan. For the full hardware specifications of the VIA VIA ARTiGO A950 system, as well as further ordering information, please download the datasheet here.
Software
VIA ARTiGO A950
The VIA ARTiGO A935 system BSP supports Yocto 3.1 and Android 10.0. VIA ARTiGO A935 Yocto 3.1 and Android 10.0 EVK packages to enable the system hardware functionality can be downloaded here. A full set of software customization services that speed up time to market and minimize development costs is also available.
[668.6 MB] | v1.4.0 | 2022-04-22 |
[304.9 MB] | v1.1.0 | 2022-02-14 |
Stories
VIA at Conexpo-Con/Agg 2023
A look at the key highlights from the VIA booth at the the largest construction industry trade show in North America.
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Boost Efficiency with the VIA Fleet Cloud Management Portal
Translate alerts, warnings, trip histories, and more into actionable intelligence through the VIA Fleet Cloud Management Portal.
How Dash Cams Protect You from Crash for Cash Scams
The high value of car insurance pay-outs has led to a growing number of so-called ‘crash for cash’ incidents on the roads.
EcoMulch VIA Mobile360 M810 SVS Solution Case Study
Facilities that use heavy equipment to process tree material to produce mulch hugely benefit from in-vehicle systems that enable drivers to boost visual and situational awareness.
From Seatbelts to AI: Car Safety Evolution
Where technology leads, culture must follow: the car safety evolution has gone a long way, from seatbelts and airbags to modern AI.
Documentation
| Datasheet | 2022-10-26 | |
| Quick Start Guide | v1.00 | 2022-10-20 |
| Android 10.0 EVK Quick Start Guide | v1.00 | 2023-02-03 |
| Yocto 3.1 EVK Quick Start Guide | v1.00 | 2023-02-03 |
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