VIA Edge AI Developer Kit
Speed up time-to-market for smart camera, signage, kiosk, and robotics systems and devices optimized for video AI applications with the VIA Edge AI Developer Kit powered by the Qualcomm® APQ8096SG Embedded Processor. The kit combines the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is optimized for intelligent real-time video capture, processing, and edge analysis. A choice of Android & Linux BSPs available.
The VIA Edge AI Developer Kit features the highly-integrated VIA SOM-9X20 module powered by the Qualcomm® APQ8096SG Embedded Processor and SOMDB2 carrier board.
Measuring just 8.2cm x 4.5cm, the VIA SOM-9X20 comes with 64GB eMMC Flash memory and 4GB LPDDR4 SDRAM onboard and offers rich I/O and display expansion options through its MXM 3.0 314-pin connector, including USB 3.0, USB 2.0, HDMI 2.0, SDIO, PCIe, MIPI CSI, MIPI DSI, and multi-function pins for UART, I2C, SPI, and GPIO. The module also provides a full range of wireless connectivity options including GPS, BT 4.1, and Wi-Fi 802.11 a/b/g/n/ac through an integrated combo module featuring two antenna connectors.
To facilitate the integration of a camera for Edge AI video applications, an optional 13MP CMOS camera module (COB 1/3.06” 4224×3136 pixels) is also available.
The Android 8.0 BSP includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of the Qualcomm® Hexagon™ DSP, Qualcomm® Adreno™ 530 GPU, or Qualcomm® Kryo™ CPU to power AI applications. A user account and a valid SOM-9X20 serial number are required in order to download the available Android and Linux software packages for the SOM-9X20. Click here to proceed.
A full set of software customization services that speed up time to market and minimize development costs is also available.
The VIA Edge AI Developer Kit is available in two configurations from the VIA Embedded online store:
1. VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module (COB 1/3.06” 4224×3136 pixels): US$629 plus shipping
2. VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board: US$569 plus shipping
*Optional 10.1” MIPI LCD touch panel: US$179 plus shipping.
For more information, please visit: https://www.viaembeddedstore.com/shop/boards/edge-ai-developer-kit/
For the fastest and most flexible path for accelerating the design and manufacturing of new Edge AI and application-specific IoT systems and devices, you can also take advantage of the VIA Custom IoT Platform Design Service. This delivers a one-stop custom system design solution that covers all steps of the development process, including the definition of the core system specifications, rapid prototyping, hardware and software development, I/O and wireless connectivity integration, and management of the path2production.
The VIA Edge AI Developer Kit is primed for the development and optimization of video AI applications such as facial recognition and object detection for a myriad of smart camera, smart signage, interactive kiosk, and intelligent robotics systems and devices.
All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, and Qualcomm Adreno are products of Qualcomm Technologies, Inc. Qualcomm, Snapdragon, and Adreno are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo is a trademark of Qualcomm Incorporated.
Get the PDF version of the VIA Edge AI Developer Kit datasheet, or browse the information below:
|Processor||Qualcomm® APQ8096SG Embedded Processor
- Two high-performance Kryo cores up to 2.342GHz
- Two low power Kryo cores up to 1.593GHz
|System Memory||4GB POP LPDDR4 RAM|
|Storage||64GB UFS 2.1 Flash Memory|
|Graphics||Qualcomm® Adreno™ 530 GPU
3D graphics accelerator with 64-bit addressing 624MHz
Graphics engine supporting OpenGL ES 3.1/GEP, GL4.4, DX11.3/4, OpenCL 2.0, Renderscript-Next
Supports H.264, VP8, HEVC 8/10-bit, VP9 video decoding up to: 4K@60fps, 1080p@240fps, 8 x 1080p@30fps
|Trusted Platform Module||TPM1.2 : ST33TPM12I2C|
|Wireless Connectivity||NFA324A-12H32 QCA6174A-1 Wi-Fi 802.11a/b/g/n/ac + BT 4.1 combo LGA module with 2 antenna connectors
Qualcomm WGR7640 GPS/GNSS RF receiver with antenna connector
|HDMI||Integrated HDMI 2.0 Transmitter|
|Support I/O through MXM 3.0 Connector||1 HDMI 2.0 port
2 MIPI DSI 4-Lane connectors
3 MIPI CSI 4-Lane connectors
1 USB 3.0 OTG
1 USB 2.0 host
Multi-function pins for UART, I2C, SPI, GPIO
2 PCIe 2.0 (1-Lane)
|Operating System||Android 8.0, Linux kernel 3.18.44|
|Operating Temperature||-20°C ~ 70°C|
|Operating Humidity||0% ~ 95% (non-condensing)|
|Form Factor||8.2cm x 4.5cm (3.23" x 1.77")|
VIA Edge AI Developer Kit Documentation
|Edge AI Developer Kit Quick Guide||v1.00||2018-05-16|
VIA Edge AI Developer Kit Downloads
In order to download the available Board Support Packages and Evaluation Kit Images for the SOM-9X20 a user account and a valid SOM-9X20 serial number are required. Click the button below to create an account or to login access to the download page.
VIA Edge AI Developer Kit Ordering Information
|10GWG23Q00020||Qualcomm® APQ8096SG Embedded Processor @ 2.342GHz/1.593GHz||SOM module with Qualcomm® APQ8096SG Embedded Processor, 64GB UFS, 4GB POP LPDDR4 RAM, HDMI, 2 DSI, 3 CSI, USB 3.0, USB 2.0, UART, GPIO, SDIO, Wi-Fi + Bluetooth 4.1, GPS/GNSS, 2 PCIe 2.0 1-Lane|
|10GWH00000020||N/A||SOMDB2 carrier board|
|STK-VT6093-00A1||Qualcomm® APQ8096SG Embedded Processor @ 2.342GHz/1.593GHz||SOM-9X20 starter kit
Packing List: SOM-9X20 module, SOMDB2 carrier board, VT6093 audio module, COM cable, AC adapter, Power cord, 2 Antennas for Wi-Fi & Bluetooth