Optimize system innovation with our flexible high-performance embedded modules.
Available in unrivaled choice of industry-standard SOM, Qseven™, COM Express®, and ETX® form factors, our boards combine leading-edge compute and multimedia performance and low power consumption with rich I/O and connectivity features and flexible customization options. Designed and manufactured to the most stringent quality and reliability standards, they come with up to 7 years of longevity to support customers with extended product life cycles.
An extensive range of hardware and software customization services is available to speed up your Edge AI, HMI, and IoT system development and bring truly groundbreaking products to global markets.
Available in unrivaled choice of industry-standard SOM, Qseven™, COM Express®, and ETX® form factors, our boards combine leading-edge compute and multimedia performance and low power consumption with rich I/O and connectivity features and flexible customization options. Designed and manufactured to the most stringent quality and reliability standards, they come with up to 7 years of longevity to support customers with extended product life cycles.
An extensive range of hardware and software customization services is available to speed up your Edge AI, HMI, and IoT system development and bring truly groundbreaking products to global markets.
Arm-based Modules
| Model | SoC | Form Factor | Carrier Board |
|---|---|---|---|
| VIA SOM-9X20 | Qualcomm® APQ8096SG Embedded Processor | SOM | SOMDB2 |
| VIA QSM-8Q60 | NXP i.MX 6QuadPlus Cortex-A9/ NXP i.MX 6DualLite Cortex-A9 | Qseven™ Rev. 2.0 | QSMDB2 |
| VIA QSM-8Q80-MM | NXP i.MX 8M Mini Quad/Dual Cortex-A53 and 400MHz Cortex-M4 | Qseven™ Rev. 2.1 | QSMDB3 |
| VIA SOM-6X80 | VIA Cortex-A9 SoC | SOM | SOMDB3 |
| VIA SOM-6X50 | VIA Cortex-A9 SoC | SOM | SOMDB1 |
| VIA VTS-8589 | NXP i.MX 6Quad Cortex-A9 | OPS |
x86-based Modules
| Model | Processor | Form Factor | Carrier Board |
|---|---|---|---|
| VIA COMe-9X90 | VIA Nano® X2 E-Series | Type 6 COM Express | COMEDB4 |
| VIA COMe-8X92 | VIA Nano® X2 E-Series | Type 6 COM Express | COMEDB2 |
| VIA COMe-8X90 | VIA Nano® X2 E-Series | Type 6 COM Express | COMEDB2 |
| VIA ETX-8X90 | VIA Nano® X2 E-Series | ETX | ETXDB1 |
| VIA ETX-8X90-10GR | VIA Eden® X1 | ETX | ETXDB1 |
What’s new?
See what else we’ve been working on recently.
20
Jan
VIA New Year 2020 Interviews: Ciaran Mac Neill
As with many companies, the festive season and the arrival of a new year is a time for us as a company to evaluate the year that has past, and...
20
Jan
VIA Intern Diaries: From Market Research to Bubble Tea
Imagine this: you are in a plane, with just a few hours to go until you reach a country you really don’t know much about, on the verge of starting...
03
Jan
VIA Co-Sponsors Tech Innovation Challenge in Shenzhen, China
Hosted in Shenzhen, China, by the Universities of Chicago, and Southern California, VIA was delighted to co-sponsor the 2019 Francis & Rose Yuen Tech Innovation Challenge, an event that invited...
17
Dec
Smart City Development and the Needs of the Elderly
As cities around the world move into an era of Smart city planning and implementation, one of the key challenges is meeting the needs of an increasingly aging population. Currently...
