Available in unrivaled choice of industry-standard SOM, Qseven™, COM Express®, and ETX® form factors, our boards combine leading-edge compute and multimedia performance and low power consumption with rich I/O and connectivity features and flexible customization options. Designed and manufactured to the most stringent quality and reliability standards, they come with up to 7 years of longevity to support customers with extended product life cycles.
An extensive range of hardware and software customization services is available to speed up your Edge AI, HMI, and IoT system development and bring truly groundbreaking products to global markets.
Arm-based Modules
| Model | SoC | Form Factor | Carrier Board |
|---|---|---|---|
| VIA SOM-9X20 | Qualcomm® APQ8096SG Embedded Processor | SOM | SOMDB2 |
| VIA QSM-8Q60 | NXP i.MX 6QuadPlus Cortex-A9/ NXP i.MX 6DualLite Cortex-A9 | Qseven™ Rev. 2.0 | QSMDB2 |
| VIA QSM-8Q80-MM | NXP i.MX 8M Mini Quad/Dual Cortex-A53 and 400MHz Cortex-M4 | Qseven™ Rev. 2.1 | QSMDB3 |
| VIA SOM-6X80 | VIA Cortex-A9 SoC | SOM | SOMDB3 |
| VIA SOM-6X50 | VIA Cortex-A9 SoC | SOM | SOMDB1 |
| VIA VTS-8589 | NXP i.MX 6Quad Cortex-A9 | OPS |
x86-based Modules
| Model | Processor | Form Factor | Carrier Board |
|---|---|---|---|
| VIA ETX-8X90 | VIA Nano® X2 E-Series | ETX | ETXDB1 |
| VIA ETX-8X90-10GR | VIA Eden® X1 | ETX | ETXDB1 |
What’s new?
See what else we’ve been working on recently.
Notes from the Field: VIA Vehicle Safety System Design Philosophy
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VIA Demonstrates the Future of Large Vehicle Safety at Embedded World 2020 with the Launch of the VIA Mobile360 M810 System
Reduces risk of accidents involving buses, coaches, and other large vehicles Supports up to six HD FOV-40° and FOV-190° cameras plus two CAN bus ports Provides drivers with the latest...
VIA New Year 2020 Interviews: Giuseppe Amato
We conclude our VIA New Year 2020 Interview series with an interesting chat with Giuseppe Amato, European Technical and Business Development Manager here at VIA. Working closely with customers in...
Notes from the Field: VIA AMOS-3006 Embedded Transportation System
We plan to introduce a number of new products at Embedded World 2020 next week, starting with the latest addition to our highly successful family of ruggedized VIA AMOS-3000 Series...
