Optimize the reliability and energy consumption of industrial equipment, HVAC systems, and lighting fixtures with our slim, low profile VIA ARTiGO Series systems. Packing rich connectivity and I/O features in a durable and compact enclosure, these highly integrated systems provide dependable solutions for a wide array of building management, automation control, IoT gateway, and HMI applications.
VIA ARTiGO Series systems are available in a variety of models and configurations, and integrate a variety of NXP Arm Cortex SOCs or low power VIA QuadCore Series x86 processors into compact fanless enclosures that that are small enough to fit into almost any environment.
VIA ARTiGO Series systems are available in a variety of models and configurations, and integrate a variety of NXP Arm Cortex SOCs or low power VIA QuadCore Series x86 processors into compact fanless enclosures that that are small enough to fit into almost any environment.
Arm-based Systems
| Model | SoC | Connectivity | I/O |
|---|---|---|---|
| VIA ARTiGO A830 | NXP i.MX 6DualLite Cortex-A9 | 1 GLAN | 1 HDMI 5 COM 1 3-Pole Phoenix RS-485 6 USB 2.0 1 Mini USB 2.0 |
| VIA ARTiGO A820 | NXP i.MX 6DualLite Cortex-A9 | 1 GLAN 1 10/100Mbps LAN Optional Wi-Fi Optional 3G | 1 HDMI 1 COM 3 USB 2.0 1 DIO |
| VIA ARTiGO A630 | VIA Cortex-A9 dual-core SoC | 1 10/100Mbps LAN Optional Wi-Fi Optional 3G | 1 HDMI 1 COM 2 USB 2.0 1 Micro USB |
| VIA ARTiGO A600 | VIA Cortex-A9 | 1 10/100Mbps LAN Optional Wi-Fi | 1 Mini HDMI 1 COM 4 3-Pole Phoenix RS-485 2 Mini USB 2.0 |
x86-based Systems
| Model | Processor | Connectivity | I/O |
|---|---|---|---|
| VIA ARTiGO A1250 | VIA QuadCore E-Series | 1 GLAN | 1 Mini HDMI 1 VGA 2 USB 3.0 2 USB 2.0 |
What’s new?
See what else we’ve been working on recently.
20
Jan
VIA New Year 2020 Interviews: Ciaran Mac Neill
As with many companies, the festive season and the arrival of a new year is a time for us as a company to evaluate the year that has past, and...
20
Jan
VIA Intern Diaries: From Market Research to Bubble Tea
Imagine this: you are in a plane, with just a few hours to go until you reach a country you really don’t know much about, on the verge of starting...
03
Jan
VIA Co-Sponsors Tech Innovation Challenge in Shenzhen, China
Hosted in Shenzhen, China, by the Universities of Chicago, and Southern California, VIA was delighted to co-sponsor the 2019 Francis & Rose Yuen Tech Innovation Challenge, an event that invited...
17
Dec
Smart City Development and the Needs of the Elderly
As cities around the world move into an era of Smart city planning and implementation, one of the key challenges is meeting the needs of an increasingly aging population. Currently...
