In response to the growing demand for Embedded Android applications in China, we are pleased to announce the VIA Embedded Android Forum 2015 will take place on May 27th.
Software Engineering Services
You can now sign up for new Board Support Package (BSP) and Evaluation Kit (EVK) email notifications on the relevant ARM product pages!
We’ve seen a tremendous amount of interest in the VIA SMART ETK at Embedded World this week, particularly for embedded Android system design applications.
VIA provides a comprehensive suite of Hardware , Software, and Cloud Engineering Services to enable our customers to transform innovative ideas into ground-breaking products and solutions.