• Mobile-ITX form factor, the smallest existing COM, sized in 6 cm x 6 cm
  • Onboard DDR2 512MB soldered memory chip
  • Supports one VGA and one TTL/DVP
  • Supports one 1-lane PCI Express
  • Supports five USB 2.0 ports


EPIA-T700 Mobile-ITX Board

The VIA EPIA-T700 is the first product based on the Mobile-ITX form factor. Measuring a mere 6cm x 6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.

Powered by a specially miniaturized, fanless 1GHz VIA Eden® ULV processor, the EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications where ultra cool, ultra quiet, reliable performance is essential.

Multimedia support comes by way of the VIA VX820 media system processor, which adds a wealth of key features including the VIA C-9 DX9 integrated graphics core, the VIA C-Motion video engine with hardware acceleration of MPEG-2, MPEG-4, WMV9, and VC1 video formats, and VIA Vinyl HD Audio supporting up to eight channels of HD output.

An integrated multi-configuration transmitter enables display connection to TTL LCD panels and CRT monitors. Added flexibility is added through carrier board configurations that integrate the DVP interface to include LVDS and DVI support. Other integrated data bus technologies include PCI Express and Ultra DMA.

VIA Technologies Japan株式会社