Mediatek Genio 1200 SoC

Mediatek Genio 1200 SoC

Dual MIPI display and CSI-2 camera support

Dual MIPI display and CSI-2 camera support

Rich wireless connectivity options

Rich wireless connectivity options



Accelerate the development of groundbreaking systems for demanding industrial, commercial, and consumer edge AI and IoT applications with the VIA SOM-7000 module. Featuring the lightning-fast MediaTek Genio 1200 octa-core SoC, this highly integrated low-power module provides the blistering AI, graphics, and compute performance required for the most demanding industrial, commercial, and consumer AIoT use cases.

Combining dual MIPI DSI display and dual MIPI CSI-2 camera support with dual-band Wi-Fi, BT 5.2, Gigabit Ethernet, and optional 5G, the VIA SOM-7000 enables flexible expansion and connectivity options to meet diverse application needs. For the full hardware specifications of the VIA SOM-7000 module and VIA SOMDB7 carrier board, download the datasheet to find out more.

VIA SOM-7000 Module featuring MediaTek Genio 1200 SOC usage scenarios


VIA SOM-7000 Module featuring MediaTek Genio 1200 SOC

VIA SOM-7000 Module

VIA SOMDB7 carrier board

VIA SOMDB7 Carrier Board

The VIA SOM-7000 module is powered by a 2.0GHz MediaTek Genio 1200 octa-core SoC featuring four Cortex A78 @ 2.2GHz and four Cortex A55 @ 2.0GHz processors plus support for UHD Hardware accelerated H.265/H.264 video decoding. This high-performance SoC also features a five-core graphics engine capable of advanced 3D graphics, as well as an integrated AI processor for computer vision, deep learning, and neural network acceleration applications.

When combined with the VIA SOMDB7 carrier board, the VIA SOM-7000 module provides a wealth of camera and display integration options, including support for dual MIPI CSI cameras and up to three MIPI DSI, HDMI, and LVDS displays. High-speed connectivity is enabled by dual-band Wi-Fi 6, Bluetooth 5.2 and up to three Gigabit Ethernet ports, as well as an integrated SIM card slot and optional 5G adaptor. Three USB 2.0 ports, up to three USB 3.1 ports, one M.2 B-key slot, and one MicroSD card slot provide flexible I/O configuration options.

The VIA SOM-7000 module measures 82mm x 80mm (3.22″ x 3.15″) and comes with a two-sided heat spreader. The VIA VAB-912 carrier board is based on an SBC form factor measuring 151mm x 134mm.


VIA SOMDB7 carrier board


The VIA SOM-7000 BSP supports Yocto 4.0.2 and Android 13.0. Software customization services that speed up time to market and minimize development costs are also available.

Yocto 4.0.2 EVK [Coming Soon]
Important: By downloading these software packages, you indicate your acceptance of the VIA Software License agreement. If you do not agree with any of the terms and conditions, do not continue to download the software.

Get In Touch

The VIA SOM-7000 module can be purchased as a discrete module or together with the VIA SOMDB7 carrier board and optional 5G wireless module. To see how it can be tailored for your specific use cases, contact us for more information!

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VIA Technologies, Inc.
VIA Technologies, Inc.