VIA SOM-9X20
Highly-integrated module powered by the Qualcomm® Snapdragon™ 820 embedded platform, delivering the ideal balance of leading-edge performance and stunning visual and audio capabilities in a versatile and ultra-compact package.
VIA Launches VIA SOM-6X80 Module for Automated Information Display and Ticketing Systems
An ultra-compact low-power SOM that accelerates the development and deployment of automated ticketing, signage, and kiosk systems for retail, transportation, and industrial IoT applications.
VIA SOM-9X20 module now Microsoft Azure Certified for IoT
The Microsoft Azure Certified for IoT program helps businesses get started on their IoT projects quickly by connecting them with an ecosystem of partners that have offerings that can easily connect to the Azure IoT Suite.
VIA Honored as Best Alibaba Cloud IoT Intelligent Manufacturing Partner
VIA also announced their commitment to boost cooperation with the Ali Cloud business to promote this initiative in order to accelerate the development of a vibrant intelligent manufacturing ecosystem with upstream and downstream partners.
VIA and Migu Announce Strategic Cooperation Agreement to Enable Personalized Consumer Experiences for China Retail Market
VIA and Migu Co., Ltd today announced a strategic cooperation agreement focused on enabling Smart VIP Customer Experiences for the China retail market.
VIA Releases Linux BSP for VIA SOM-9X20 Module Powered by Qualcomm® Snapdragon™ 820E Embedded Platform
Linux BSP based on Yocto 2.0.3 for the VIA SOM-9X20 Module is now available, enabling rapid development of next-generation Edge AI systems and devices.
VIA Unveils Edge AI System Line for Automotive, Enterprise IoT, and Smart City Applications
Developing world’s fastest Neural Network Inference Engine to accelerate the development and deployment of native deep learning inference applications in next-generation Edge AI devices.
