The core components of the kit are the VIA SOM-9X20 and SOMDB2 Carrier Board that combine the advanced graphics and compute capabilities of the Qualcomm® Snapdragon™ 820E Embedded Platform with a full suite of wireless connectivity.
If you’re attending the Embedded Vision Summit 2018, stop by our booth number 609! We will have all our latest Computer Vision solutions on display, including the VIA Smart Facial Recognition System, the VIA Mobile360 License Plate Recognition System, and VIA Mobile360 ADAS.
33% of our respondents from Greater China, who are likely to implement computer vision*, continue to place more weight on smart factory automation, compared to only 22% in the rest of the world. This disparity could be explained by the Made in China 2025 initiative.
Highly-integrated module powered by the Qualcomm® Snapdragon™ 820 embedded platform, delivering the ideal balance of leading-edge performance and stunning visual and audio capabilities in a versatile and ultra-compact package.