Harness the unrivaled reliability and versatility of our ruggedized VIA AMOS Series systems to drive greater efficiency, flexibility, and responsiveness across your manufacturing operations. With their compact, fanless, and dust-proof designs, these high-performance systems deliver 24/7 operation in the most demanding temperatures and environments.
VIA AMOS Series systems are available in a variety of models and configurations, and integrate a variety of NXP Arm Cortex SoCs or low power VIA Nano® E-Series and VIA Eden® Series x86 processors into compact, fanless, and dust-proof enclosures. With their unique modular design and rich I/O features, VIA AMOS Series systems offer multiple opportunities for expansion and customization while remaining quick and easy to assemble. They are also extremely low power and support a wide operating temperature range, making them an ideal solution for a wide range of industrial, transportation, and smart city applications.
VIA AMOS Series systems are available in a variety of models and configurations, and integrate a variety of NXP Arm Cortex SoCs or low power VIA Nano® E-Series and VIA Eden® Series x86 processors into compact, fanless, and dust-proof enclosures. With their unique modular design and rich I/O features, VIA AMOS Series systems offer multiple opportunities for expansion and customization while remaining quick and easy to assemble. They are also extremely low power and support a wide operating temperature range, making them an ideal solution for a wide range of industrial, transportation, and smart city applications.
Arm-based Systems
| Model | SoC | Connectivity | I/O |
|---|---|---|---|
| VIA AMOS-825 | NXP i.MX 6Quad Cortex-A9 | 1 GLAN Wi-Fi + BT 4.1 + GPS | 2 CAN Bus 1 COM 3 USB 2.0 1 Micro USB 2.0 |
| VIA AMOS-820 | NXP i.MX 6QuadPlus Cortex-A9 NXP i.MX 6Quad Cortex-A9 | 1 GLAN | 1 HDMI 2 CAN Bus 2 COM 3 USB 2.0 1 Micro USB 2.0 |
x86-based Systems
| Model | Processor | Connectivity | I/O |
|---|---|---|---|
| VIA AMOS-3005 | Eden® X4 | VIA 2 GLAN Optional Wi-Fi + BT 4.1 Optional 4G LTE | 1 HDMI 1 VGA 2 COM 2 USB 3.0 2 USB 2.0 1 DIO |
| VIA AMOS-3003 | VIA Nano® X2 E-Series | 2 GLAN Optional Wi-Fi Optional 3G | 1 Mini-HDMI 1 VGA 3 COM 2 USB 3.0 2 USB 2.0 1 DIO |
| VIA VIPRO VP7910 | VIA Eden® X4 | 2 GLAN Optional Wi-Fi | 1 Mini-HDMI 1 VGA 3 COM 2 USB 3.0 2 USB 2.0 1 DIO |
What’s new?
See what else we’ve been working on recently.
20
Jan
VIA New Year 2020 Interviews: Ciaran Mac Neill
As with many companies, the festive season and the arrival of a new year is a time for us as a company to evaluate the year that has past, and...
20
Jan
VIA Intern Diaries: From Market Research to Bubble Tea
Imagine this: you are in a plane, with just a few hours to go until you reach a country you really don’t know much about, on the verge of starting...
03
Jan
VIA Co-Sponsors Tech Innovation Challenge in Shenzhen, China
Hosted in Shenzhen, China, by the Universities of Chicago, and Southern California, VIA was delighted to co-sponsor the 2019 Francis & Rose Yuen Tech Innovation Challenge, an event that invited...
17
Dec
Smart City Development and the Needs of the Elderly
As cities around the world move into an era of Smart city planning and implementation, one of the key challenges is meeting the needs of an increasingly aging population. Currently...
