VIA SOM-7X25
VIA SOM-7X25 is a SMARC module designed to accelerate the development of advanced Edge application systems and devices. Powered by a low-power, high-performance Intel Atom® processor, this highly integrated platform delivers excellent graphics, video, and computing performance required for a wide range of applications, including smart home, retail, industrial automation, and commercial use cases.
Low-Power Intel Atom®Processor for Edge Applications
Advanced LPDDR5 Memory and Intel UHD Graphics
Hight Definition Audio Integrated
Rich Interface Support
Hardware
VIA SOM-7X25 Module
VIA SOMDB6 Carrier Board
VThe VIA SOM-7X25 module is powered by an Intel Atom® (Alder Lake-N) x7211E, delivering robust multitasking capabilities with outstanding power efficiency. It features integrated Intel® UHD Graphics driven by the Intel® UHD architecture to seamlessly handle advanced visual rendering and IoT Gateways& Protocol Converters , Smart Kiosks& Digital Signage Workloads.
When combined with the VIA SOMDB6 carrier board, the VIA SOM-7X25 module provides a wealth of display and high-speed I/O integration options. This includes support for one HDMI port, one DisplayPort, a dual-channel 18/24-bit LVDS panel connector, dual 2.5 Gigabit Ethernet ports, a SATA 3.0 connector, and flexible M.2 slots for Wi-Fi, Storage, and LTE expansion modules.
The VIA SOM-7X25 module complies with the SMARC 2.1.1 standard form factor, measuring a compact 82mm x 50mm (3.22＂×2＂). The VIA SOMDB6 carrier board measures 220mm x 166mm x 37mm. For the full hardware specifications of the VIA SOM-7X25 module and VIA SOMDB6 carrier board, download the following datasheet.
Software
VIA SOM-7X25 Software Packages
The VIA SOM-7X25 comes backed by a stable Board Support Package (BSP) to help developers quickly and seamlessly port their Application scenario to the Intel x86 architecture.
| Windows® 11 |
Get In Touch
VIA SOM-7X25 module can be purchased as a discrete core module or together with the VIA SOMDB6 carrier board and optional 4G/5G wireless module as a complete development kit. Whether you are looking to build highly customized Industrial IoT gateways or smart terminal systems, our professional team is here to provide consultation and technical support for your specific deployment.
Stories
VIA at COMPUTEX 2026: Showcasing Next-Gen AI Dash Cam
Join VIA at COMPUTEX 2026 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1), Booth L0818, where we will showcase our latest innovation, the VIA Mobile360 D800 AI Dash Cam.
OpenClaw x ARTiGO A5000: Your First Step into Agentic AI with a Trusted Hardware Platform
Discover how the VIA ARTiGO A5000 leverages the OpenClaw framework to drive Agentic AI innovation. Streamline your transition from evaluation to deployment with our edge computing scenarios and production-ready hardware platform.
VIA at Embedded World 2026: Demonstrating Edge AI and Automotive innovations
Discover Embedded World and we are presenting three live scenarios that illustrate the future of retail, security, and fleet management.
Smart Shopping: Transforming Retail with the AI Kiosk
The AI Kiosk is a gateway to the Future Shopping Experience. By delivering rapid, AI-driven insights, retailers can provide engaging and efficient service to every customer.
How to apply the popular AI framework “PyTorch” to develop the AMOS-9100 and VAB-5000
Explore the steps to port a model defined in PyTorch to VIA Edge AI products and the impact that accelerators have on inference speed.
VIA at COMPUTEX 2025: Showcasing the Future of AI-Powered Smart Access Control
Join VIA at COMPUTEX 2025 from Tuesday, June 20, to Friday, June 23, at the Taipei Nangang Exhibition Center.