VIA EPIA-Mi300 Series
High CP value for Smart POS Retail, Edge AIoT plus Vision applications for industrial, commercial, and IoT gateway. Powered by Intel® Core™ Series 3 processors, EPIA-Mi300 combines CPU, Xe3 graphics and integrated NPU acceleration in a compact 3.5-inch form factor. Featuring rich industrial I/O, flexible 5G/Wi-Fi connectivity, multi-display support and scalable storage, the platform is designed for next-generation smart retail, industrial automation, machine vision and intelligent edge applications.
Up to 40 TOPS AI performance with integrated CPU, Xe3 GPU, and NPU
4× LAN, 4× COM, and 16-bit GPIO for flexible device integration
Multiple M.2 slots for 5G/LTE, Wi-Fi 7, Bluetooth, and NVMe expansion
3.5″ SBC design with DDR5, UFS/NVMe storage and Windows/Linux support
Hardware
VIA EPIA-Mi300 Board Front
VIA EPIA-Mi300 Board Rear
VIA EPIA-Mi300 board is a compact 3.5-inch industrial SBC designed for next-generation edge computing and AI-enabled embedded applications. Powered by Intel® Core™ Series 3 processors, the platform integrates Xe3 graphics and an NPU architecture to provide power-efficient AI acceleration for real-time inference, vision processing, and intelligent analytics. It supports up to 64GB DDR5-6400 memory with IBECC, together with UFS 4.0, SATA III, and PCIe x4 NVMe storage, delivering a balanced combination of computing performance, storage flexibility, and system reliability for industrial deployments.
TFor device integration, EPIA-Mi300 provides rich industrial I/O including four Ethernet ports, optional PoE/PSE support, four configurable RS-232/422/485 interfaces, and 16-bit GPIO. Multiple M.2 interfaces further extend connectivity with support for 4G/5G modules, Wi-Fi 7, Bluetooth, and NVMe SSDs. HDMI, DisplayPort, LVDS, USB 4.0 Type-C, and USB 3.2 interfaces enable flexible connection to displays, cameras, sensors, and peripheral devices across a wide range of embedded systems.
With its SBC form factor measuring just 146mm (W) x 102mm (D) (5.75” x 4.02” ), the VIA Epia-Mi300 fits easily into compact AI-ready industrial edge platform for intelligent embedded applications
Software
VIA EPIA-Mi300 Software Packages
The VIA EPIA-Mi300 BSP supports Windows 11 and Intel® OpenVINO™, enabling optimized AI inference across the CPU, Xe3 GPU, and NPU for simplified, power-efficient computer vision deployment.
| BIOS | ||
| Windows® 11 |
Get In Touch
Unlock the complete capabilities of compact computing with the VIA EPIA-Mi300, seamlessly blending stylish design with robust functionality to deliver unparalleled performance. Reach out to us for further details!
Stories
VIA at COMPUTEX 2026: Showcasing Next-Gen AI Dash Cam
Join VIA at COMPUTEX 2026 at the Taipei Nangang Exhibition Center Hall 1 (TaiNEX 1), Booth L0818, where we will showcase our latest innovation, the VIA Mobile360 D800 AI Dash Cam.
OpenClaw x ARTiGO A5000: Your First Step into Agentic AI with a Trusted Hardware Platform
Discover how the VIA ARTiGO A5000 leverages the OpenClaw framework to drive Agentic AI innovation. Streamline your transition from evaluation to deployment with our edge computing scenarios and production-ready hardware platform.
VIA at Embedded World 2026: Demonstrating Edge AI and Automotive innovations
Discover Embedded World and we are presenting three live scenarios that illustrate the future of retail, security, and fleet management.
Smart Shopping: Transforming Retail with the AI Kiosk
The AI Kiosk is a gateway to the Future Shopping Experience. By delivering rapid, AI-driven insights, retailers can provide engaging and efficient service to every customer.
How to apply the popular AI framework “PyTorch” to develop the AMOS-9100 and VAB-5000
Explore the steps to port a model defined in PyTorch to VIA Edge AI products and the impact that accelerators have on inference speed.
VIA at COMPUTEX 2025: Showcasing the Future of AI-Powered Smart Access Control
Join VIA at COMPUTEX 2025 from Tuesday, June 20, to Friday, June 23, at the Taipei Nangang Exhibition Center.