VIA at Japan IT Week Spring 2023: Intelligent Solutions for Innovative Industrial, Commercial, and Home Use Cases

Where: Tokyo Big Sight, Japan.

When: April 5-7, 2023

Booth: E46-30

Join VIA in Tokyo for Japan IT Week Spring 2023. Discover how our market-leading VIA Intelligent Solutions enable you to transform your operations to make them safer, more efficient, and more sustainable, in even the most challenging environments. Combining advanced AI, computer vision, and cloud technologies with powerful and reliable platforms, systems, and devices, VIA Intelligent Solutions open up boundless opportunities for businesses to harness the power of rich IoT and visual data to optimize operations.


VIA VAB-970 and VIA SOM-9X70 Intelligent Edge Platforms

Featuring the new MediaTek Genio 700 octa-core processor, the VIA VAB-970 board and VIA SOM-9X70 module provide flexible, feature-rich platforms that speed up time-to-market for power-efficient smart home, retail, and industrial IoT systems and devices.

Based on a highly integrated Pico-ITX form factor measuring 10cm x 7.2cm (3.9″ x 2.8″), VIA VAB-970 combines one HDMI display port and one MIPI-CSI-2 connector with Wi-Fi 6 and BT 5.2 wireless connectivity. Other highlights include one Gigabit Ethernet port, two USB-A 3.0 ports, one 40-pin Raspberry Pi standard GPIO header, and a nano SIM connector. An optional 4G module will also be available.

The VIA SOM-9X70 module provides ample room for expansion with its dual MIPI DSI display and dual MIPI CSI camera support, as well as HDMI and DisplayPort connectors. In addition to supporting 802.11ac Wi-Fi and BT 5.0, the module comes with a wealth of I/O features, including one USB 3.1 port, three USB 2.0 ports, one Gigabit Ethernet port, one GPIO port, one SDIO port, and one PCIe slot.


VIA SOM-9X12 Intelligent Edge Platform

The VIA SOM-9X12 intelligent edge platform provides a powerful solution for accelerating the development of innovative systems for edge AI and IoT deployments in industrial, commercial, and consumer settings. Equipped with the lightning-fast MediaTek Genio 1200 octa-core SoC, this versatile platform delivers exceptional AI, graphics, and compute performance for the most demanding use cases.

The VIA SOM-9X12 module and companion VIA VAB-912 carrier board make it easy to harness the power and performance of the MediaTek Genio 1200 with their rich I/O and connectivity features, including support for two MIPI CSI cameras, up to three dual MIPI DSI and HDMI displays, as well as Wi-Fi 6 + BT 5.2, Gigabit Ethernet, and optional 5G. Its comprehensive software stack facilitates the development of innovative applications that enhance operational safety and productivity.


VIA ARTiGO A935/A950 Intelligent Edge Systems

Based on the VIA SOM-9X35 and VIA SOM-9X50 intelligent edge platforms, the VIA ARTiGO A935 and VIA ARTiGO A950 systems enable you to accelerate development times by providing reliable and stable solutions for rapid prototyping and production.


VIA AMOS-3007 Intelligent Edge System

The VIA AMOS-3007 is a robust, fanless system designed to function reliably in harsh industrial environments. Equipped with an extensive range of I/O features, it supports a wide variety of applications, including industrial equipment monitoring, data visualization, process automation, and building management. The system’s compact design and low power consumption make it an ideal solution for both indoor and outdoor settings.

The latest addition to our growing family of VIA Intelligent Edge Solutions, the VIA AMOS-3007 is powered by an Intel Atom E3950 processor, providing reliable performance with 4GB of LPDDR4 memory and 64GB of eMMC storage. It also offers various connectivity options, such as Gigabit Ethernet, USB 3.0, HDMI, and RS-232/422/485 ports.

The VIA AMOS-3007 is built to withstand shock and vibration, as well as operate in temperatures ranging from -20°C to 60°C. If you’re looking to enhance and optimize your industrial and enterprise edge deployments, the VIA AMOS-3007 is an indispensable tool that enhances efficiency and speeds up your workflow.

VIA Mobile360 Forklift Safety System

VIA Mobile360 Forklift Safety System

Prevent pedestrian collisions and injuries in busy production and logistics environments with the VIA Mobile360 Forklift Safety System. Featuring support for pinpoint people detection, this smart and reliable IP67-rated system alerts forklift operators whenever someone steps within a hazardous range of their vehicle. To ensure that operators remain fully attentive while behind the wheel, the system can also feature a DSS (Driver Safety System) that issues an alert whenever it detects fatigue, smoking, and phone usage through a driver camera.

The VIA Mobile360 Forklift Safety System is available in a variety of packages and configurations to meet diverse operational safety scenarios, including the 3PD Package featuring three wide-angle people detection cameras and the 2PD Package combining two people detection cameras with a DSS camera. The optional VIA WorkX Connect Cloud Management Service makes it easy for executives to monitor forklift utilization and driver behavior in real-time and identify opportunities for operational improvement.

Why Choose VIA?

VIA’s innovative use of AI and computer vision to create intelligent systems that can automate and optimize a range of tasks is well established. Our products and solutions are designed to improve efficiency, safety, and productivity for a myriad of applications, from fleet management to manufacturing. With a focus on cutting-edge technology and a commitment to customer satisfaction, VIA has a comprehensive range of intelligent solutions to fit a diverse array of industries, while maintaining the ability to tailor each product to fit your specific requirements.

Please feel free to drop by the VIA booth located at Booth E46-30 at Tokyo Big Sight, Japan. If you would like to arrange an appointment with our experts, or need more information regarding this event, you can contact us here.

VIA Technologies, Inc.
VIA Technologies, Inc.