VIA Debuts VIA SOM-9X12 Module at Japan IT Week Autumn 2022 October 18, 2022 Press ReleasesHighly integrated low-power platform streamlines the development of intelligent edge systems for demanding industrial, commercial, and consumer applications.
A Sneak Peek at the VIA EPIA-M930 and VIA AMOS-3007 October 4, 2022 AnnouncementsAt Japan IT Week Autumn 2022 in Tokyo, we plan to unveil the successors to our popular VIA EPIA-M910 and VIA AMOS-3005 platforms.