We Connect
Learn about the latest smart building solutions that VIA will show at Embedded World 2019, including the VIA ARTiGO A820 with FogHorn Lightning edge intelligence and Microsoft Azure Cloud connectivity.
If you’re planning to add personalized services to your stores that harness the latest Edge AI technologies to boost customer loyalty and increase staff efficiency, check out the VIA Smart Retail Engagement System at the VIA booth at Embedded World 2019.
We’d like to take this opportunity to wish you all a Happy Chinese New Year of the Pig and share a few news updates on our boards, systems, modules and of our products that are reaching the EOL stage with you before the holiday starts.
Check out the latest updates to the BSP and EVK packages and documentation for our VIA ALTA DS 3, VIA AMOS-825, VIA AMOS-820, and VIA ARTiGO A820 systems and VIA SOM-9X20 modules.
The China International Industry Fair held in Shanghai gave us the ideal opportunity to introduce our new family of VIA Edge AI systems powered by the Qualcomm® Snapdragon 820E Embedded Platform.
