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With Embedded World 2019 less than a month away, we have been busy making the final preparations the event. One of the highlights of our booth will be our Edge AI solutions for smart transportation, including the VIA Mobile360 ADAS system.
We’d like to take this opportunity to wish you all a Happy Chinese New Year of the Pig and share a few news updates on our boards, systems, modules and of our products that are reaching the EOL stage with you before the holiday starts.
With ISC East just around the corner, here is a brief overview of the high-performance Edge AI and Computer Vision systems that we will be showing at the Javits Center in New York. If you are planning on attending the event visit us at booth number 659.
Check out the latest updates to the BSP and EVK packages and documentation for our VIA ALTA DS 3, VIA AMOS-825, VIA AMOS-820, and VIA ARTiGO A820 systems and VIA SOM-9X20 modules.
The China International Industry Fair held in Shanghai gave us the ideal opportunity to introduce our new family of VIA Edge AI systems powered by the Qualcomm® Snapdragon 820E Embedded Platform.
