Discover VIA Intelligent Solutions at Japan IT Week Spring 2024
Where: Tokyo Big Sight, Japan
When: April 24th – 26th, 2024
Booth: 30-2
Transform Your Operations with VIA Intelligent Solutions
Discover how our market-leading VIA Intelligent Solutions enable you to transform your operations to make them safer, more efficient, and more sustainable, even in the most challenging environments. Combining advanced AI, computer vision, and cloud technologies with powerful and reliable platforms, systems, and devices, VIA Intelligent Solutions open up boundless opportunities for businesses to harness the power of rich IoT and visual data to optimize operations.
Event highlights: Experience VIA Intelligent Solutions
SOM-3000 | 5000 | 7000
Discover a trio of cutting-edge solutions for AI and IoT applications at our event. The VIA SOM-3000 module, powered by the MediaTek Genio 350 quad-core SoC, delivers rapid development and deployment for edge AI solutions, perfect for vision and voice processing needs like facial recognition and object identification. Meanwhile, the VIA SOM-5000 board features the MediaTek Genio 700 octa-core processor, providing intense AI, graphics, and computing capabilities tailored for industrial, commercial, and consumer applications. Lastly, the VIA SOM-7000 module, embedded with the MediaTek Genio 1200 octa-core SoC, offers unparalleled performance in AIoT environments, making it ideal for industrial automation, smart retail, healthcare, and consumer gadgets.
Whether you’re in commercial, medical, educational, or consumer sectors, these solutions provide the foundation for innovation across a wide range of applications.
VAB-3000 | 5000 | 7000
Experience the next frontier of edge AI development with VIA’s range of innovative boards. The VIA VAB-3000, featuring the low-power MediaTek Genio 350 quad-core SoC, empowers streamlined creation and deployment of devices, excelling in mainstream edge AI and IoT applications like facial recognition and object identification. Meanwhile, the VIA VAB-5000 takes AI development to new heights with its MediaTek Genio 700 octa-core processor, offering unparalleled performance for industrial, commercial, and consumer applications.
With advanced connectivity options including Wi-Fi 6, Bluetooth 5.2, and optional 4G LTE, along with rich expansion possibilities like HDMI and USB 3.1, the VAB-5000 is the ultimate platform for developers seeking to innovate in fields ranging from industrial automation to cutting-edge consumer gadgets and medical devices.
ARTiGO A3000 | A5000 | A7000
Discover the future of smart edge and IoT appliances with VIA’s ARTiGO series. The VIA ARTiGO A3000, a compact fanless system, integrates the low-power MediaTek Genio 350 quad-core SoC with extensive I/O and connectivity features, providing a streamlined development experience. Whether deployed in commercial, consumer, or industrial settings, the VIA ARTiGO A3000 offers flexibility and reliability for diverse applications such as smart access control, interactive kiosks, vending machines, and POS solutions. Join us to explore our range of cutting-edge System-on-Modules (SOMs) and Visual AI Boxes (VABs), alongside the compact yet powerful ARTiGO series, and witness firsthand how MediaTek is shaping the future of technology.
Live Demos:
Visit our booth to witness the future of security and surveillance with live demonstrations showcasing cutting-edge access control and facial recognition systems. Experience CyberLink’s FaceMe AI seamlessly integrated with our SOM-5000 module, and see Axell’s object recognition software in action on VIA’s ARTiGO A5000 system. This convergence of advanced technologies provides unparalleled insights into real-time data processing, shaping the future of security landscapes.
VIA Mobile360 Forklift Safety System (Video display):
Prevent pedestrian collisions and injuries in bustling production and logistics environments with the VIA Mobile360 Forklift Safety System. Engineered to deliver smart and reliable protection, this IP67-rated system features pinpoint people detection capabilities, alerting forklift operators whenever individuals step into hazardous proximity to their vehicle.
Join Us at Tokyo Big Sight
We invite you to experience the future of compact computing and edge AI technology first-hand by visiting us at booth 30-2, Tokyo Big Sight, from April 24th to 26th, 2024. Whether you’re a developer, a business leader, or an enthusiast of cutting-edge technology, the innovations presented by VIA Technologies offer a glimpse into a future where smart edge and IoT devices redefine our interaction with technology.
If you would like more information, please contact us.
