• Ultra compact 70mm x 70mm Qseven™ (2.0) form factor
  • 1.0GHz NXP i.MX 6QuadPlus or i.MX 6DualLite Cortex-A9 SoC
  • Wide operating temperature range from -20°C ~ 70°C
  • 7 year longevity support
  • Evaluation carrier board available


VIA QSM-8Q60 Qseven™ Module

The VIA QSM-8Q60 is an ARM-based Qseven™ form factor module powered by the choice of either a 1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad core SoC with advanced graphics and memory performance or a 1.0GHz NXP i.MX 6DualLite Cortex-A9 dual core SoC, delivering the perfect balance of high performance and rich multimedia features in an ultra-compact package for a wide range of embedded system applications such as industrial automation, transportation, medical and infotainment.


The VIA QSM-8Q60 measures 70mm x 70mm and is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). Supporting a wide operating temperature of -20°C ~70°C, the VIA QSM-8Q60 is designed for optimum flexibility in the harshest environments.

Featuring an on-board Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3-10666 SDRAM, the module also offers rich I/O and display expansion options including 4 USB 2.0 ports, one HDMI port, one dual-channel 18/24-bit LVDS panel, 3 COM ports, Gigabit Ethernet, 2 CAN bus and PCIe x1.


The VIA QSM-8Q60 features a Linux BSP which includes the kernel (3.14.28) and bootloader source codes for the NXP i.MX 6DualLite version and an Android 6.0 BSP or Linux BSP with the kernel (4.1.15) and bootloader source codes for the NXP i.MX 6QuadPlus SoC. Other features include a Tool Chain to help make adjustments to the kernel and to support the VIA QSMBD2 carrier board I/O and other hardware features.

A full set of software customization services that speed up time to market and minimize development costs are also available.


Customers can take advantage of our multi-I/O evaluation carrier board or can utilize VIA’s extensive technical support in developing a custom baseboard.


Get the PDF version of the QSM-8Q60 datasheet, or browse the information below:

Model NameQSM-8Q60-QPQSM-8Q60
Processor1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad-core SoC1.0GHz NXP i.MX 6DualLite Cortex-A9 dual-core SoC
System Memory2GB DDR3-1066 SDRAM
Storage4GB eMMC Flash memory
Boot Loader4MB SPI Flash ROM
GraphicsVivante GC2000+ GPUVivante GC880
3 integrated, independent 3D/2D and video graphics processing units
Supports OpenGL® ES 2.0, OpenCL and OpenVG™ 1.1 hardware accleration
Supports MPEG-2, VC-1and H.264 video decoding up to 1080p
Supports SD encoding
2 Independent, integrated 3D/2D graphics processing units
Graphics engines support OpenGL® ES 2.0, OpenVG 1.1 hardware acceleration
Support MPEG-2, VC-1 video decoding up to 1080p
LANMicrel KSZ9031RNX Gigabit Ethernet Transceiver with RGMII support
AudioI2S Audio Interface
HDMIIntegrated HDMI 1.4 Transmitter
USBSMSC USB2514 USB 2.0 High Speed 4-port hub controller
Supported Expansion I/O1 PCIe x1
Supported I/O4 USB 2.0 ports
1 USB OTG client
1 HDMI port
1 Dual-channel 18/24-bit LVDS panel
3 COM (TX/RX) ports
1 Gigabit Ethernet
2 CAN bus
1 I2S
1 I2C
Onboard I/O1 Micro SD card slot
Operating SystemAndroid 6.0, Linux Kernel 4.1.15Linux Kernel 3.14.28
Operating Temperature-20°C ~ 70°C
Storage Temperature-20°C ~ 70°C
Operating Humidity0% ~ 95% (non-condensing)
Form Factor7.0cm x 7.0cm (2.76" x 2.76")
ComplianceQseven™ Rev. 2.0 module


QSM-8Q60 Documentation

User Manualv1.022016-10-05
Linux Quick Start Guide for BSP v2.0.1v1.002016-08-18
Linux Installation Guide for EVK v2.0.1v1.002016-08-18

QSM-8Q60 Software Downloads

Linux Board Support Package (BSP) 4.2GBv2.0.12016-09-05
Linux Evaluaiton Kit (EVK) 278.8MBv2.0.12016-09-05
Important: By downloading these software packages, you indicate your acceptance of the VIA Software License agreement. If you do not agree with any of the terms and conditions, do not continue to download the software.


  • U-Boot version: 2014.04
  • Kernel version: 3.14.28
  • Evaluation image: OpenEmbedded-core built with Yocto 1.7 Daisy
  • Development based on NXP fsl-yocto-3.14.28_1.0.0 (Yocto 1.7 Daisy)
  • Support SPI with eMMC or Micro SD boot (default)
  • Support HDMI or LVDS single display (default HDMI output)
  • Support HDMI audio output
  • Support AUO LVDS resistive touch panels (through USB interface)
    • AUO 10.4″ G104XVN01.0 (1024×768)
    • AUO 7″ G070VW01 (800×480)
  • Support COM1 and COM3 (TX/RX), COM2 as debug port
  • Support COM4, COM5, COM6 and COM7 (RS-232 / RS-422 / RS-485)
  • Support 2 CAN bus (TX/RX)
  •  Support Gigabit Ethernet (LAN1)
  • Support 10/100Mbps Ethernet (LAN2)
  • Support Line-in, Line-out, Mic-in
  • Support VNT9271 USB Wi-Fi dongle
  • Support EMIO-1541 miniPCIe Wi-Fi module
  • Support EMIO-2550 miniPCIe Mobile Broadband module
  • Support Watchdog and GPIO



QSM-8Q60 Ordering Information

Part NumberSoCDescription
10GEC10H40020NXP i.MX 6QuadPlus Cortex-A9 @ 1.0GHzQseven™ module with 1.0GHz NXP i.MX 6QuadPlus Cortex-A9, 4GB eMMC, 4MB SPI ROM, 2GB DDR3 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), Gigabit Ethernet, 10/100Mbps Ethernet, 2 CAN bus, PCIe x1, Micro SD card slot
10GEC10700020NXP i.MX 6DualLite Cortex-A9 @ 1.0GHzQseven module with 1.0GHz NXP i.MX 6DualLite Cortex-A9, 4GB eMMC, 4MB, SPI ROM, 2GB DDR3-1066 SDRAM, HDMI, 4 USB 2.0, 1 USB OTG client, LVDS, 3 COM (TX/RX), Gigabit Ethernet, 2 CAN bus, PCIe x1, Micro SD card slot
15GFL000000-10N/AQSM-8Q60 evaluation carrier board (QSMBD2) with CAN bus cable and DC power cable

QSM-8Q60 Accessories

Part NumberDescription
00GO27100BU2B0D0VNT9271 IEEE 802.11b/g/n USB Wi-Fi dongle
EMIO-1541-00A1VNT9485 IEEE 802.11b/g/n miniPCIe Wi-Fi module with assembly kit and antenna
EMIO-2550-00A1 3.75G HSPA/UMTS mobile broadband full size miniPCIe module with GPS and SIM card slot

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