VIA will debut the ultra-sleek Vpai Slide 720-degree camera platform at the Hong Kong Electronics Fair, which takes place from April 13 – 16.
VPai Platform opens up exciting opportunities HTC Vive Developers to generate innovative new forms of immersive content for world’s leading VR system.
Available in a choice of stylish ultra-portable form factors, the seven models enable consumers to easily capture, view, and share their experiences in stunning panoramic image and video formats.
The new VIA VTS-8589 OPS board will debut at Embedded World 2017 being held this March 14-16 in Nuremberg, Germany. The VIA booth is located #2-551 in Hall 2 of the Nuremberg Exhibition Center.
VIA Launches VIA SOM-6X50 IoT Acceleration Platform for Automated Ticketing, Signage, and Kiosk Devices
New VIA SOM-6X50 IoT Acceleration Platform for the rapid development of automated ticketing, signage, and kiosk devices on display @ Embedded World 2017.